PCB of the Month - June

Description:

Gold wire bonding on ENEPAG Surfaces: Final surface in electroless Nickel, electroless Palladium, autocatalytic Gold

Typical coating thicknesses

  • chem. Nickel: 3-8µm
  • chem. Palladium: 0,1-0,3µm
  • chem. Gold: 0,02-0,05µm

Highlights:

  • applicable on all PCB built ups

Customer Benefits:

  • Optimised for gold wire bonding
  • Also in combination with solder joint

Applications:

  • LTCC (ceramic) replacement
  • LED applications with gold wire bonding
  • Fine Pitch applications