Comparison DCB vs. Inlay

  tl_files/2-Produkte_und_Loesungen/images/leiterplatte-des-monats/dcb-klein.jpg tl_files/2-Produkte_und_Loesungen/images/leiterplatte-des-monats/Inlay_Board_02-klein.jpg
Criteria DCB (DBC) Inlay

High Temperature Capability (today)

++ +

Current drive capability / ampacity

+ ++

Form factor / height

+ ++

Mech. Stability / Ruggedness

+ ++

Interconnect Approach for System

+ ++

Single board solution (to be combined w/ Logic Board)
-> Higher reliability

n/a +

Tooling Costs (Module)

+ ++

System Costs

+ ++

++ better / less expensive