PCB of the Month - September

Description:

  • Inlay Board
  • chem. Sn final surface
  • 3-layers stackup
  • Ground contact via deep drilling hole

Highlights:

  • heavy copper inlay of 1,5 mm is embedded in a form-fit way into the resin matrix of the PCB
  • maximum heat dissipation of the semiconductor component
  • deep routed cavity for direct connection to the semiconductor

Customer Benefits:

    • Best heat dissipation on smallest installation space through direct connection to the package
    • cost optimised processing of the Inlays in strap shape
 

Applications:

  • DCB replacement in the automotive field, e.g. for motor-fan-controller

Comparison DCB vs. Inlay