The company
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Applications
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The company
Company presentation
Mission statement
Locations
The company's history
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CSR
Public information as per Para. 8a and 11 of the Major Accidents Ordinance
Sectors
Automotive
Aviation
Industrial & medical
Communication & computing
Applications
Power electronics
Inlay
Heavy copper
CU-IMS
Combi Board
p² Pack Embedding 48 V
Logic circuits
Multilayer
HDI
FR4 Flex
Bond PCBs
Impedance
High-frequency and sensor technology
RF 6-24 GHz
RF 77 GHz
Embedded Antenna
Technologies & solutions
PCB technologies
Standard PCBs
Multilayer
HDI
Impedance
Innovative technologies & solutions
Inlay
Bond (bare die) PCBs
RF 6-24 GHz
RF 77 GHz
Embedded Antenna
FR4 Flex
CU-IMS
Heavy copper
Combi Board
Semiconductor embedding & systems
p² Pack
Surface finishes & materials
Surface finishes
Solder mask
Materials
Innovation centre
Service & Consulting
Investors & Media
Market and Strategy
Current news
Ad-hoc announcement
Financial news
Annual report
Download reports
Financial reports
Download reports
Company Key Figures
Explanations Financial Figures
Half-year comparison
Group Key Figures
Presentations
Financial Calendar
Annual Shareholders' Meeting
Archive
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Managers’ Transaction
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Corporate Management Declaration
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Press releases
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Specialist press
General press
Downloads
Careers
Job vacancies
Students & trainees
University students
Integrated degree: Business & Industry
Integrated degree: Business Informatics and Business Engineering
Contact info
D
E
CN
P
The company
Company presentation
Mission statement
Locations
The company's history
Institutions
CSR
Public information as per Para. 8a and 11 of the Major Accidents Ordinance
Sectors
Automotive
Aviation
Industrial & medical
Communication & computing
Applications
Power electronics
Inlay
Heavy copper
CU-IMS
Combi Board
p² Pack Embedding 48 V
Logic circuits
Multilayer
HDI
FR4 Flex
Bond PCBs
Impedance
High-frequency and sensor technology
RF 6-24 GHz
RF 77 GHz
Embedded Antenna
Technologies & solutions
PCB technologies
Standard PCBs
Innovative technologies & solutions
Semiconductor embedding & systems
Surface finishes & materials
Innovation centre
Service & Consulting
Investors & Media
Market and Strategy
Current news
Ad-hoc announcement
Financial news
Annual report
Download reports
Financial reports
Download reports
Company Key Figures
Explanations Financial Figures
Half-year comparison
Group Key Figures
Presentations
Financial Calendar
Annual Shareholders' Meeting
Archive
Corporate governance
Managers’ Transaction
Voting rights notifications
Compliance declarations
Corporate Management Declaration
Press & media
Press releases
Schweizer in the media
Downloads
Careers
Job vacancies
Students & trainees
University students
Integrated degree: Business & Industry
Integrated degree: Business Informatics and Business Engineering
Contact info
The company
Sectors
Applications
Technologies & solutions
Investors & Media
Careers
Contact info
info@schweizer.ag
+49 (0) 7422 512 111
Locations
Newsletter
Annual reports
Homepage
Investors & Media
Annual report
Download reports
Annual reports
Geschäftsbericht 2019
Geschäftsbericht 2018
Geschäftsbericht 2017
Geschäftsbericht 2016
Geschäftsbericht 2015
Geschäftsbericht 2014
Geschäftsbericht 2013
Geschäftsbericht 2012
Geschäftsbericht 2011
Geschäftsbericht 2010
Geschäftsbericht 2009