The company
Sectors
Applications
Technologies & solutions
The company
Company presentation
Mission statement
Locations
The company's history
Institutions
CSR
Public information as per Para. 8a and 11 of the Major Accidents Ordinance
Sectors
Automotive
Aviation
Industrial & medical
Communication & computing
Applications
Power electronics
Inlay
Heavy copper
CU-IMS
Combi Board
p² Pack Embedding 48 V
Logic circuits
Multilayer
HDI
FR4 Flex
Bond PCBs
Impedance
High-frequency and sensor technology
RF 6-24 GHz
RF 77 GHz
Embedded Antenna
Technologies & solutions
PCB technologies
Standard PCBs
Multilayer
HDI
Impedance
Innovative technologies & solutions
Inlay
Bond (bare die) PCBs
RF 6-24 GHz
RF 77 GHz
Embedded Antenna
FR4 Flex
CU-IMS
Heavy copper
Combi Board
Semiconductor embedding & systems
p² Pack
Surface finishes & materials
Surface finishes
Solder mask
Materials
Innovation centre
Service & Consulting
Investors & Media
Market and Strategy
Current news
Ad-hoc announcement
Financial news
Annual report
Download reports
Financial reports
Download reports
Company Key Figures
Explanations Financial Figures
comparison period previous year
Group Key Figures
Presentations
Financial Calendar
Annual Shareholders' Meeting
Archive
Corporate governance
Managers’ Transaction
Voting rights notifications
Compliance declarations
Corporate Management Declaration
Press & media
Press releases
Schweizer in the media
Specialist press
General press
Downloads
Share
Basic information
Careers
Job vacancies
Students & trainees
University students
Integrated degree: Business & Industry
Integrated degree: Business Informatics and Business Engineering
Contact info
Design Rules
D
E
CN
P
The company
Company presentation
Mission statement
Locations
The company's history
Institutions
CSR
Public information as per Para. 8a and 11 of the Major Accidents Ordinance
Sectors
Automotive
Aviation
Industrial & medical
Communication & computing
Applications
Power electronics
Inlay
Heavy copper
CU-IMS
Combi Board
p² Pack Embedding 48 V
Logic circuits
Multilayer
HDI
FR4 Flex
Bond PCBs
Impedance
High-frequency and sensor technology
RF 6-24 GHz
RF 77 GHz
Embedded Antenna
Technologies & solutions
PCB technologies
Standard PCBs
Innovative technologies & solutions
Semiconductor embedding & systems
Surface finishes & materials
Innovation centre
Service & Consulting
Investors & Media
Market and Strategy
Current news
Ad-hoc announcement
Financial news
Annual report
Download reports
Financial reports
Download reports
Company Key Figures
Explanations Financial Figures
comparison period previous year
Group Key Figures
Presentations
Financial Calendar
Annual Shareholders' Meeting
Archive
Corporate governance
Managers’ Transaction
Voting rights notifications
Compliance declarations
Corporate Management Declaration
Press & media
Press releases
Schweizer in the media
Downloads
Share
Basic information
Careers
Job vacancies
Students & trainees
University students
Integrated degree: Business & Industry
Integrated degree: Business Informatics and Business Engineering
Contact info
Design Rules
The company
Sectors
Applications
Technologies & solutions
Investors & Media
Careers
Contact info
Design Rules
info@schweizer.ag
+49 (0) 7422 512 111
Locations
Newsletter
Annual reports
Homepage
Investors & Media
Annual report
Download reports
Annual reports
Annual Report of Year 2021 (german only, english translation will follow soon)
Annual Report of Year 2020
Annual Report of Year 2019
Annual Report of Year 2018
Annual Report of Year 2017
Annual Report of Year 2016
Annual Report of Year 2015
Annual Report of Year 2014
Annual Report of Year 2013
Annual Report of Year 2012
Annual Report of Year 2011
