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CSR
Public information as per Para. 8a and 11 of the Major Accidents Ordinance
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Power electronics
Inlay
Heavy copper
CU-IMS
Combi Board
p² Pack Embedding 48 V
Logic circuits
Multilayer
HDI
FR4 Flex
Bond PCBs
Impedance
High-frequency and sensor technology
RF 6-24 GHz
RF 77 GHz
Embedded Antenna
Technologies & solutions
PCB technologies
Standard PCBs
Multilayer
HDI
Impedance
Innovative technologies & solutions
Inlay
Bond (bare die) PCBs
RF 6-24 GHz
RF 77 GHz
Embedded Antenna
FR4 Flex
CU-IMS
Heavy copper
Combi Board
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p² Pack
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Integrated degree: Business & Industry
Integrated degree: Business Informatics and Business Engineering
Contact info
D
E
CN
P
The company
Company presentation
Mission statement
Locations
The company's history
Institutions
CSR
Public information as per Para. 8a and 11 of the Major Accidents Ordinance
Sectors
Automotive
Aviation
Industrial & medical
Communication & computing
Applications
Power electronics
Inlay
Heavy copper
CU-IMS
Combi Board
p² Pack Embedding 48 V
Logic circuits
Multilayer
HDI
FR4 Flex
Bond PCBs
Impedance
High-frequency and sensor technology
RF 6-24 GHz
RF 77 GHz
Embedded Antenna
Technologies & solutions
PCB technologies
Standard PCBs
Innovative technologies & solutions
Semiconductor embedding & systems
Surface finishes & materials
Innovation centre
Service & Consulting
Investors & Media
Market and Strategy
Current news
Ad-hoc announcement
Financial news
Annual report
Download reports
Financial reports
Download reports
Company Key Figures
Explanations Financial Figures
Quarterly Key Figures
Group Key Figures
Presentations
Financial Calendar
Annual Shareholders' Meeting
Archive
Corporate governance
Managers’ Transaction
Voting rights notifications
Compliance declarations
Corporate Management Declaration
Press & media
Press releases
Schweizer in the media
Downloads
Careers
Job vacancies
Students & trainees
University students
Integrated degree: Business & Industry
Integrated degree: Business Informatics and Business Engineering
Contact info
The company
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Contact info
info@schweizer.ag
+49 (0) 7422 512 111
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Presentations
Conference Call Results Q1 2021
Conference Call results Q3 2020
Conference Call Results HY1 2020
Conference Call results Q1 2020
Roadshow October 2019
Conference Call Results Q1 2019
Conference Call Results Q1 2018
Conference Call Results Q1 2017
Conference Call Results Q1 2016
Investoren Präsentation November 2015
Roadshow Oktober 2015
Investoren Präsentation Juli 2015
Conference Call Results Q1 2015
