Higher currents require tailored copper profiles in PCBs. Because installation space is always limited, the Z-axis must be utilised. With inner layer copper thicknesses of up to 400 µm, applications with continuous currents of more than 200 A are possible.
Inner layer Cu thicknesses of 105 µm, 210 µm, or 400 µm depending on current load
Variable outer layer Cu thicknesses of 50 µm – 240 µm
Complex high-current structures possible
Up to 4 x 400 µm Cu per PCB possible
Many years of series production experience with 400 µm Cu on inner layers
Basic structure can be combined with other lay-up variants