PACK EMBEDDING

Efficient embedding of power semiconductors into PCBs

Background

The SCHWEIZER (smart) p² Pack is a technology for the embedding of power semiconductors into PCBs. This procedure is not simply a new packaging method. More importantly, it allows power electronics systems to be developed in accordance with a completely different philosophy. Applications developed with the smart p² Pack technology enable higher power levels, compact designs, and a high integration depth. The production chain for system suppliers and the lay-up and interconnection technology in the system are greatly simplified as a result. In addition, there are potential cost savings at system level.

Applications

All applications requiring the switching of high powers can benefit from the advantages of the p² Pack. The main application fields lie in conversions between direct current and alternating current systems. Increasingly, these systems face higher power requirements along with expectations of high reliability and a long life. The p² Pack is a key element in achieving this.

Benefits

  • Reduced thermal resistance
  • Reduced switching losses due to lower inductance in the system
  • Reduced conduction losses in static scenarios
  • Higher power densities possible, so a lower silicon requirement
  • Significant improvement in product robustness and life

Special features

  • Simplified production chain when building systems
  • None of the yield problems associated with semiconductors
  • Reduction in system complexity if power and logic have to be distributed over fewer individual components
  • Fewer components, connections, and predetermined breaking points

48 V technology in the automotive sector is one of the largest growth areas. Thanks to the increasing amount of electrification in the automotive sector, requirements on the efficiency and flexibility of the technology are becoming more demanding, and this is accompanied by short development times before market launch. SCHWEIZER offers an optimised solution here, vastly expanding the limits of what is possible when it comes to semiconductor power. Because it enables low inductance switching, we recommend the use of an 80 V MOSFET. For more information, simply request our data sheet.

The embedding of high-precision shunts enables cost-effective, efficient current measurement. Like in the case of p² Pack, you benefit from the excellent heat dissipation properties, low ohm connection, and precise determination of the phase current.

Benefits

  • Excellent heat dissipation
  • Low ohm connection and low power dissipation
  • Electrical insulation of the current path
  • Low inductance

Applications

All applications requiring precise phase current measurement

Special features

  • Standard design available
  • Resistance values: 0.1 mΩ; 0.2 mΩ; 0.5 mΩ
  • Low tolerances of +/-1%

"Seeing is believing" applies to our technology, too. That's why we offer you the opportunity to try out the smart p² Pack technology and experiment on a ready-to-use built and tested evaluation kit. This preliminary assessment is easy and does not require the design of your own system. In addition to the embedded MOSFETs, the EvalKit also has an embedded shunt for integrated current measurement.

Schematic cross section (not original size) of a smart p² Pack. The switching cells allow a complete inverter to be realised like with standard SMD components.

Contact info

Rainer Jäckle

Telefon: +49 7422 512-291

E-Mail: rainer.jaeckle@schweizer.ag

Rainer Jäckle