November 12, 2024 -
November 15, 2024
Background
SCHWEIZER's rigid multilayer PCBs can contain plated and non-plated through hole and blind & buried vias. Multilayer PCBs are produced with FR4 or higher quality base materials. As standard, a maximum of 18 layers are used and PCB thicknesses in the range of 0.6 mm to 3.2 mm are realised.
Parameter | Standard | High standard |
Number of layers | 1-18 | >18 |
PCB thickness | 0.6-3.2 mm | 0.2-4.2 mm |
Maximum PCB size | 584*575 mm² | 584*575 mm² |
140°C, 150°C, 170°C | >170°C | |
Glass fabric | 106, 1080, 2116, 7628 | 106, 1080, 2116, 7628 |
Copper foils | 18 µm, 35 µm, 70 µm, 105 µm | 210 µm, 400 µm |
Inner layer thickness | 75 µm, 100 µm, 150 µm, 200 µm, 360 µm, 510 µm, 710 µm, 1000 µm, 1200 µm, 1500 µm | 50 µm |
Min. track width and conductor spacing of outer layer* | 70 µm / 70 µm | 60 µm / 60 µm |
Min. track width and conductor spacing of inner layer* | 60 µm / 60 µm | 50 µm / 50 µm |
Smallest drill diameter | 0.2 mm | 0.15 mm |
Aspect ratio | 1:6 | 1:8 |
Outer layer annular ring | 150 µm | 100 µm |
Inner layer annular ring | 200 µm | 150 µm |
Min. solder mask dam* | 80 µm | 50 µm |
Solder mask color | Green | Blue, red, white, black |
Imm. tin, OSP, imm. NiAu (ENIG), ENEPIG/ENEPAG, Plated NiAu, HAL, Bond Gold, Hard Gold | Imm. silver | |
Legend print color | Yellow, white, black | Blue, red |
*: Values dependent on copper layer thickness