Multilayer PCBs with blind & buried vias


SCHWEIZER's rigid multilayer PCBs can contain plated and non-plated through hole and blind & buried vias. Multilayer PCBs are produced with FR4 or higher quality base materials. As standard, a maximum of 18 layers are used and PCB thicknesses in the range of 0.6 mm to 3.2 mm are realised.


Control devices in the automotive sector, aviation engineering, communications electronics, and industrial electronics


For the miniaturisation of electrical devices, wiring can take place over multiple layers to save space and increase the packing density of the components. The layers can be electrically connected by means of mechanically drilled via holes and blind & buried vias.

Special features

To increase reliability for complex lay-ups with via holes, buried vias, and blind vias, the plugging process can be used if required. The plugged holes can also be plated over with copper if necessary.

Schematic layout of a multilayer PCB with buried vias, plugged buried vias, and plugged and over-plated buried vias



High standard

Number of layers



PCB thickness

0.6-3.2 mm

0.2-4.2 mm

Maximum PCB size

584*575 mm²

 584*575 mm²

FR4 materials: Glass transition temperature

140°C, 150°C, 170°C


Glass fabric

106, 1080, 2116, 7628

106, 1080, 2116, 7628

Copper foils

18 µm, 35 µm, 70 µm, 105 µm

210 µm, 400 µm

Inner layer thickness

75 µm, 100 µm, 150 µm, 200 µm, 360 µm, 510 µm, 710 µm, 1000 µm, 1200 µm, 1500 µm

50 µm

Min. track width and conductor spacing of outer layer*

70 µm / 70 µm

60 µm / 60 µm

Min. track width and conductor spacing of inner layer*

60 µm / 60 µm

50 µm / 50 µm

Smallest drill diameter

0.2 mm

0.15 mm

Aspect ratio



Outer layer annular ring

150 µm

100 µm

Inner layer annular ring

200 µm

150 µm

Min. solder mask dam*

80 µm

50 µm

Solder mask color


Blue, red, white, black

Final finishes

Imm. tin, OSP, imm. NiAu (ENIG), ENEPIG/ENEPAG, Plated NiAu, HAL, Bond Gold, Hard Gold

Imm. silver

Legend print color

Yellow, white, black

Blue, red

*: Values dependent on copper layer thickness

Design rules


Here you will find current information about our design rules and our PCB standards.

Contact info

Rainer Jäckle

Telefon: +49 7422 512-291


Rainer Jäckle