MATERIALS FOR PCBS

The right base material for every application

Background

Important PCB properties are determined by the used base material. The choice of the right base material is therefore based on the technical specification for the overall application in which the PCB will be supplied. And last but not least, the costs arising from the choice of base material play an important role.

Applications

Each sector has specific requirements for the application in question. In the automotive sector, the coarse ambient conditions and high reliability requirement influence the choice of the right base material. In telecommunications, the need for signal integrity and focus on the dielectric properties of the insulation material prevail.

High-frequency PCBs for use at up to 79 GHz have been introduced in the automotive sector through radar-supported applications such as ACC. These extremely special, expensive materials are generally used to produce hybrid circuits. This involves an outer antenna layer made from a high-frequency base material with a core made from a standard material.

Tailored material properties for specific applications

  • Power Combi Board
  • RF Combi-Board

 

Special material requirements

  • HF Combi Board: A PCB with tailoring for the required application and cost minimisation
  • Power Combi Board: Materials with high temperature stability, high insulation resistance, and good thermal conductivity
  • IMS Board: High thermal conductivity
  • p² Pack: Materials suitable for junction temperatures of up to 175°C
  • p² Pack (high-voltage/wide band gap semiconductors): Junction temperatures > 200 °C possible.

  • High temperature stability (175 to 200°C)
  • High insulation resistance (> 3.5 kV)
  • High temperature shock resistance
  • Good filling properties
  • High CAF resistance for high-volt applications
  • Low coefficient of thermal expansion (CTE) tailored to semiconductor components
  • High thermal conductivity for good heat dissipation properties

  • Stable, precisely defined dielectric properties
  • Constant prepreg thicknesses
  • Really low pattern tolerances
  • Asymmetrical PCB constructions without twisting/warping

  • Defined and stable dielectric properties (over temperature and frequency)
  • Defined and controlled impedances
  • Really low conductor tolerances and low roughness
  • Suitable for fine-pitch SMD assembly