Schramberg, May 13, May 2011 – During SMT Hybrid Packaging 2011 tradeshow from May 3 to 5 in Nuremberg, Schweizer Electronic AG for the first time cooperated with Fraunhofer IZM within the framework of a live production line. For this purpose SCHWEIZER provided PCBs which were assembled during the 3-day event within a production line, specifically set-up for demonstration purposes.
The theme of this year’s presentation „Highest Precision on Smallest Batch Sizes“ underlines the increasing requirements of the electronics industry for miniaturization of products while maintaining the same quality. The trend is towards smaller devices with significantly growing functionality. For such requirements SCHWEIZER offers a solution called i² Board®, integrating active and passive components into the inner PCB. Numerous visitors of the tradeshow booth were impressed by the company’s innovative solutions.
SCHWEIZER takes positive stock of the SMT. „For us the tradeshow appearance within the common booth of Fraunhofer IZM was an excellent solution that we plan to maintain in future. We will present our full range of services in detail during our Customer Day at the end of June at our site in Schramberg “, explains Dr. Marc Schweizer, CEO of Schweizer Electronic AG. „True to our motto ‚more than PCBs’, our customers will then have the opportunity to get on-site insights into our production, our broad scope of products and solutions and our cooperation partners.“