Schramberg, June 3, 2011 – Schweizer Electronic AG announces the introduction of the IMS Board. This new and innovative solution for applications in the area of power electronics is able to dissipate high temperatures via the PCB.
In addition to more ampacity, the booming market of power electronics also demands an optimised solution for maximum heat dissipation. Particularly for this purpose materials have been developed that offer a high thermal conductivity and at the same time best electrical insulation. A fully covered, massive metal backside ensures a fast and efficient temperature spreading and thus inhibits hotspots.
Customary Insulated Metal Substrate (IMS) solutions are equipped with aluminium back plates. In contrast, SCHWEIZER recommends the usage of copper which offers essentially better physical characteristics. A significant advantage over aluminium also is that copper is compatible with all PCB processes and allows for different surface coatings and multi-layer build-ups.
„By introducing the IMS Board we are expanding our technology building set by a solution for power electronics. Our offer particularly addresses customers who require optimised high power and heat dissipation solutions“ explains Christian Rössle, responsible for Sales & Marketing at SCHWEIZER.
Beyond the IMS Board, SCHWEIZER offers further optimised technologies for power electronics:
- Thick Copper Board of up to 400µ – when higher currents have to be carried by the PCB
- Combi Board – high power and signal processing are being combined in a cost-optimised way
- Wirelaid™ – a wire-writing PCB for cost optimised high power applications
- Inlay Board – for maximum power and heat dissipation
- Water Board – PCB with integrated water cooling