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D
E
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P
The company
Company presentation
Mission statement
Locations
The company's history
Institutions
Sustainability
Sustainability report
Notification system
Code of Conduct
Sectors
Automotive
Aviation
Industrial & medical
Communication & computing
Applications
Power electronics
Inlay
Heavy copper
CU-IMS
Combi Board
p² Pack Embedding 48 V
Logic circuits
Multilayer
HDI
FR4 Flex
Bond PCBs
Impedance
High-frequency and sensor technology
RF 6-24 GHz
RF 77 GHz
Embedded Antenna
Technologies & solutions
PCB technologies
Standard PCBs
Innovative technologies & solutions
Semiconductor embedding & systems
Surface finishes & materials
Innovation centre
Service & Consulting
Investors & Media
Market and Strategy
Current news
Ad-hoc announcement
Financial news
Annual report
Download reports
Financial reports
Download reports
Company Key Figures
Explanations Financial Figures
comparison period previous year
Group Key Figures
Presentations
Financial Calendar
Annual Shareholders' Meeting
Archive
Corporate governance
Managers’ Transaction
Voting rights notifications
Compliance declarations
Corporate Management Declaration
Press & media
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Downloads
Share
Basic information
Careers
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Design Rules
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Date
Publication/Event
2025-04-28
Annual Report 2024
2025-05-07
Interim Report 1st Quarter 2025
2025-06-27
Annual General Meeting
2025-08-08
Financial Report (half-year) 2025
2025-11-07
Interim Report 3rd Quarter 2025
