INLAY BOARD

In the case of Standard Inlay (Inlay 1.0) technology, individual inlays with a standard thickness of 1.0 mm, 1.5 mm, and 2.0 mm are used. Forming is extremely variable and can be tailored to custom application requirements. The inlays can be embedded from both sides or open on one side. If they are open on one side, this means that the inlay is visible on the bottom side for a direct connection to the heat sink. In addition, electrically insulated reverse sides with particularly thermally conductive prepreg can be manufactured.

If a complex inlay structure with multiple adjacent inlays in a small space is required, Clustered Inlay (Inlay 2.0) technology is used. The inlays are created in a grid structure and are electrically separated from each other in a subsequent process. This allows the insulation gaps between the inlays to be reduced to between 0.3 mm and 0.5 mm depending on the field of application. The standard Inlay 2.0 thickness is 1.0 mm; further thicknesses are available on request.

The Small Inlay is an enhancement of the SCHWEIZER Standard Inlays (Inlays 1.0). Thanks to special handling, it will be possible to integrate smaller inlays of up to 10 x 10 mm into PCBs in future. This technology is particularly suitable for heat sinks for power MOSFETs or LEDs.

Etched Inlay / QIT (Quasi Inlay Technology) is an innovative additive technology in the heavy copper segment that unites the advantages of inlay technology and heavy copper. Etched Inlay / QIT offers incomparable design freedom and a really quick time-to-market along with top thermal and electrical performance. With copper thicknesses up to 800 µm, even the highest requirements can be met.

The basic structure can be combined with other lay-up variants. With this technology, too, currents of several hundred amps can be carried.

Application Note