Schramberg, May 18, 2012 – For the first time Schweizer Electronic AG exhibited their products and solutions at PCIM, Europe’s biggest tradeshow for Power Electronics. Apart from their innovations in the area of power electronics, Embedding Technology in particular was well received by customers and visitors of PCIM, which took place in Nuremberg from May 8 to 10, 2012.
SCHWEIZER offers a comprehensive spectrum of PCB solutions which master the challenges of power electronics for increasing power and corresponding heat dissipation. Beyond, these PCBs often offer the possibility of replacing hitherto used material such as ceramics and lead frames in a cost efficient way.
Highlights of the exhibition on SCHWEIZER’s booth were significant parts of their innovation set. In the area of power electronics the Inlay Board was presented which can run up to 1,200 ampere. A smart p² Pack for a 40 KW electric motor with IGBTs and diodes integrated into the PCB demonstrated SCHWEIZER’s performance in the field of (Power) Embedding. As a representative for system cost reduction, an FR4 Flex 3D PCB for a telemetry module was showcased. This module is built into a vehicle’s wheel rim and is operated in a electric formula vehicle of KA-RaceIng-Team which SCHWEIZER closely cooperates with.
Christian Rössle, Vice President Sales & Marketing at SCHWEIZER summarises as follows: „Our first participation in PCIM was extremely successful. We could welcome and thoroughly consult numerous existing and potential customers. Especially our innovative products convinced many of our visitors as they offer new solution possibilities for the challenges posed by power electronics. This positive response results in our decision to definitely participate again in PCIM in the coming year.“
SCHWEIZER also demonstrated their competency in the field of premium PCBs at SMT, a tradeshow taking place at the same time and site as PCIM. As a cooperation partner of the common booth of Fraunhofer IZM Institute, the company contributed PCBs for the production line „Future Packaging“.