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D
E
CN
P
The company
Company presentation
Mission statement
Locations
The company's history
Institutions
Sustainability
Sustainability report
Notification system
Code of Conduct
Sectors
Automotive
Aviation
Industrial & medical
Communication & computing
Applications
Power electronics
Inlay
Heavy copper
CU-IMS
Combi Board
p² Pack Embedding 48 V
Logic circuits
Multilayer
HDI
FR4 Flex
Bond PCBs
Impedance
High-frequency and sensor technology
RF 6-24 GHz
RF 77 GHz
Embedded Antenna
Technologies & solutions
PCB technologies
Standard PCBs
Innovative technologies & solutions
Semiconductor embedding & systems
Surface finishes & materials
Innovation centre
Service & Consulting
Investors & Media
Market and Strategy
Current news
Ad-hoc announcement
Financial news
Annual report
Download reports
Financial reports
Download reports
Company Key Figures
Explanations Financial Figures
comparison period previous year
Group Key Figures
Presentations
Financial Calendar
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Archive
Corporate governance
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Corporate Management Declaration
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Share
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Design Rules
The company
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